Manufacturing Capabilities
Quick-Turn & Prototyping
1-5 Day Quick-Turn PCB Assembly available. No job is too small, and specialty or high complexity boards are welcomed. Other Prototype level services such as BOM Validation and basic DFM analysis are offered at no cost.
Mid-Volume Production
On shore assembly can make sense when a quick turn time is critical, sensitive Intellectual Property is involved, the end user is a government entity or data is Export Restricted, volumes are just not large enough to reap substantial economic benefit, or the customer requires added control, traceability, & involvement in the assembly process.
Custom PCBA Services
Tracer accommodates many assembly support activities such as Component Sourcing, Rework & Repair, Functional Testing, X-Ray Inspection, Encapsulation/Potting/ Coatings, Electro-Mechanical Assembly, and order fulfillment.
Our Competitive Advantage
- 24-hour quote turnaround
- Custom BOM validation software
- DFM (Design for Manufacturability) feedback
- Turnkey parts procurement OR Consigned parts Kits
- No minimum order quantity
- Flip Chip & Microelectronics assembly
- Strategic equipment platform
- Low customer count- get the Service you deserve!
- FREE local delivery available for critical orders
Our Complete Lineup
PCB Assembly
SMT
- Micro BGA with Underfill
- BGA 2,000 + Balls
- High Speed Pick & Place Line
- 11 Zone Reflow
- Click HERE to see our PCB Specs
SMT Component Specs | ||||||
QFP | BGA/CSP | General Chips/Parts | ||||
Lead Pitch | Lead Width | Ball Pitch | Ball Dia | Min Size | Max Size | |
MM | 0.22 | 0.18 | 0.25 | 0.18 | .2mm x .1mm .1mm (0201 Metric) | 55x100x28 |
Inches | 0.009 | 0.007 | 0.010 | 0.007 | .008 x .004, .004 (008004 Standard) | 2.165×3.937×1.102 |
Inspection & Testing
- SPI (Solder Paste Inspection)
- AOI (Automated Optical Inspection)
- X-RAY
- Flying Probe Testing
- Functional Testing
- Power On Voltage Measurement
- Inductance/Capacitance- Resistance Check
- Serialization/QR code/Barcode Traceability
Rework
- Hot Air rework
- BGA removal/replacement
- Wire Mods
- Production Rework projects
Specialty Services
- Assembly of FLEX & RigidFlex Circuits
- Conformal Coating
- Microelectronics Assembly
- Cleaning to Preset Resistivity or Conductivity requirements
- MSL & ESD Handling Programs
- Procurement/Supply Chain Management
- DFM (Design For Manufacturability) Analysis
- RoHS, Lead, High & Low Temp solders
- Water Soluble & No Clean Flux
- Turnkey OR Consigned Parts Kits
- Box builds/Higher Level Assembly/Electromechanical Assembly
Through Hole
- Selective Solder
- Slide Line & Wave Solder
- IPC Class 3, Space Addendum
- Press Fit Components
- Hardware
- Wires & Cables
- Swaged Components
- Staking, Epoxies & Glues
PCB Supplier Specs
Density
- Min. 2mil Trace and Space
- .006” finished hole – Drilled
- Aspect Ratio 14:1
- Micro Via .004” – Laser
- Blind and Buried Via
- HDI (High Density Interconnect)
Layer Count / Profile
- 2-40 Layers; from .008” to .450” Finished Thickness
- Sequential Lamination
- 10oz Copper
- RoHS and Eutectic
- Via in Pad / Conductive and Non-Conductive fill
- Via –Fill Copper Plate
Materials
- FR4 370 / Rogers / Taconic / Megtron
- Arlon / Nelco / Polyimide / Kapton
- Metal Clad
Finishes
- ENIG (Tracer’s preferred surface finish)
- HASL / HASL PB Free
- ENEPIG / Hard Gold / Silver / White Tin
Test & Inspection
- Flying Probe / Impedance Control / AOI
- Environmental Testing / X Sections