Tracer PCB
Assembly
Tracer combines DFM expertise, automation, and innovative technology to shorten your lead times and achieve the results you need.
Here’s Tracer’s PCB assembly by the numbers:
0
changeovers per day
0
.24%
yield
0
PCB assembly lines
Tracer’s customer service is even better:
6-12
day average turnaround time
98%
ON-TIME
DELIVERY
DELIVERY
2
day average early delivery
Tracer’s PCB
Assembly Means…
- Custom BOM validation
- DFM optimization
- Turnkey parts procurement OR consigned parts kits
- No minimum order quantity
- Flip Chip & Microelectronics assembly
- Strategic equipment platform
Tracer’s PCB Assembly Specifications
SMT
- Micro BGA with Underfill
- Components as small as 008004 standard
- Components as large as 3” sq.
- BGA 2,000 Balls – 3 mil dia.
Through Hole
- IPC Class 3
- Selective Solder
- Wave Solder
Inspection/Testing
- SPI (Solder Paste Inspection)
- AOI (Automated Optical Inspection)
- X-Ray Inspection
- Flying Probe Testing
- Functional Testing
Rework
- Hot Air
- BGA removal/replacement
- Wire Mods
Specialty Services
- Flex & Rigid-Flex Circuits
- Conformal Coating
- Microelectronics
- Box Buids/Electro-mechanical Assembly
- RoHS, Lead, High or Low Temp solders
- Water Soluble & No Clean Flux; Cleaning of No-Clean Flux
- Procurement/Supply Chain Management
Tracer’s PCB Supplier Specifications
Density
- Min. 2mil Trace and Space
- .006” finished hole - Drilled
- Aspect Ratio 14:1
- Micro Via .004” - Laser
- Blind and Buried Via
- HDI (High Density Interconnect)
Layer Count / Profile
- 2-40 Layers; from .008” to .450” Finished Thickness
- Sequential Lamination
- 10oz Copper
- RoHS and Eutectic
- Via in Pad / Conductive and Non-Conductive fill
- Via –Fill Copper Plate
Materials
- FR4 370 / Rogers / Taconic / Megtron
- Arlon / Nelco / Polyimide / Kapton
- Metal Clad
Surface Finish
- HASL / HASL PB Free / ENIG
- ENIGPIG / Hard Gold / Silver / White Tin
Inspection/Testing
- Flying Probe / Impedance Control / AOI
- Environmental Testing / X Sections